I am reading "Advanced Thermal Management Solutions on PCBs for High Power Applications":
And on page 4 is states that:
It can be seen that the thermal vias are situated in the extended thermal pads beside the pad, where the component will be placed. So, to avoid the well-known problem of solder soaking, it is not possible to place open thermal vias directly underneath a component.
I have never heard of "solder soaking", can someone please explain what the author means?
I found something called "Solder voiding" in another document which seems to be the same thing: