I'm trying to import an IC footprint into CAD software and can't seem to nail down the exact dimension for pin spacing. The two supporting documents seem to conflict with each other (Land Patterns here, and Package Drawings here).
In the drawings document the pin spacing in the Y-axis is listed as 0.55mm whereas if you calculate the pin spacing from the land patterns it works out to be 0.50625mm (4.05mm/8 pins == 0.50625mm/pin).
If I try to go with the 0.55mm spacing the pins seem to be out of bounds of the package size and the spacing seem to contradict with the D1 dimension (5.0 BSC).
What is the correct dimension I need? And is BSC 0.55mm, 1.1mm or something else?
Curse you Maxim and your vague schematics! (Only their drawings, their technical specs are great)