A full-on 'professional' design would model airflow and thermal dissipation using a tool like Flotherm. It seems like this isn't being done for your design. That’s understandable since the software tools are kind of expensive, and require a lot of effort to get good modeling.
Regardless, the ‘one weird trick’ to achieving a good air-cooled design is to ensure enough velocity past your hottest components to achieve your target junction temperature.
As far as pull air in vs. push air out, both approaches get used. A small system with just one fan and modest power favors the 'inhale' approach, focusing the highest flow velocity on the power supply.
Example: a typical desktop PC will pull air in through the power supply and blow it directly onto the switching regulator's power transistor heatsink. This ensures the highest local velocity as well as the coolest possible air for that area. The CPU (and GPU) will also have heatsinks and local fans, but otherwise rely on the gross air movement through the box coming through the PSU to keep in-case ambient temps down.
Gamer PCs will often add more case fans to improve air movement to further reduce in-case ambient air temp.
Another example: DVR set-top boxes (something I have personal experience with). The ones I worked on 'inhaled', and like a PC, blew high-velocity air across the power supply. As part of our product design we did airflow and thermal modeling, then followed up with thermal testing to ensure the critical hot spots (disk drive and SoC) were in spec.
Based on your system description, seems like your power needs are modest and you won't have significant hot spots. The DVR-like 'inhale' approach should be fine, so long as your air movement through the rest of the chassis is adequate.
If your testing does reveal hot spots you'll need to revise your mechanical design, possibly adding local heatsinks and fans. In fact, it's a good idea to plan for this, as you could delete them later if you don't need them.
Other things to consider:
- ducting/channeling to direct airflow to internal hot spots
- thermal contact with the case for passive cooling
Using the case as a radiating element is a popular approach with consumer electronics, especially for 'silent' devices.