I bought a cell phone in China (read chinese iphone), that despite the operational system is awful, when I opened to check the hardware and I found a not so bad hardware. I was able to extract microphone, motor, speaker and other interesting things. However there is an ARM processor that I couldn't remove. I'm a computer scientist (I had basic EE in the univeristy) and hobbyist. I'm able to extract components, when there is a solder to melt, but I never played with SMD. I found this tool, but there is any other way to do it?
What you want is a Hot air rework station:
This uses a gentle stream of hot air (soldering iron temperature) to melt the solder and release the components. Also, a "hot plate" can be beneficial when working with such components as BGA chips:
Failing that, put it in the oven face down and let the components fall off. (may not work depending on component size - the surface tension of the solder may well hold them in place).
You can extract (remove) the components with hot air - Majenko showed a pro tool, a paint-removing hot air gun can be the poor mans tool. Heat the board, give it a whack on the back, and a lot of components will fall of. BUT:
- survival of the components is not guaranteed (to put it mildly)
- even if they survided, could you do anything with them?
- did you check what that component, or something equivalent, would cost new (in other words, could it be worth the trouble?)
If the phone is a well known type there might be a development kit available somewhere on the web - but maybe only in Chinese :(