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Ball Grid Array - A type of chip packaging in which the "pins" or connections to the PCB is a series of small lands or pads which come prepared with small solder balls attached. When place upon the corresponding matching pattern on the PCB and subjected to solder reflow, the balls melt and form electrical and mechanical connections between the land on the package and the pad on the PCB. Characterized by attachment on the flat bottom of the package.

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Eagle - 6 Layer Via pairing error + bga fanout

With one being 0.5mm & the other being 0.42mm (The other 3 bga's being 0.65mm) Which settings within DRC do I need to change so I can fanout the smallest bga? … The auto bga router apparently does it but after scouring the web/autodesk eagle forums I've found no posts on how to manually place them. Thank you for help @Tom Carpenter. …
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