I'm designing a shielded module based on the SI4455 RF chip from Silabs. I read the datasheet and the design guidelines are pretty straightforward, I had no issues replicating most of the reference circuitry in KiCad.
However, due to the limited size of the EMI shield I'm using, I have to reduce the form factor of the RF matching network. The reference circuit shows the passives straightly distributed along the 50 Ω trace.
What I did is re-distribute the passive components so that the matching network is kept inside of the EMI shield.
My question is: Will this re-distribution or re-location of components influence the performance of the SI4455 chip in terms of range and power output? If I manage to keep the trace impedance at 50 Ω then is it okay to keep this layout?