I am trying to create the best PCB possible for my DC Motor controller. I have been looking into the different ways to make my vias for my PCB and I am a little confused on the topic of tenting and plugging and conductivity between the bottom and top layers. The general idea behind the two are:
Tenting - Apply solder mask over the via to decrease exposure to external conductors, cleaner looking but from what I'm reading it does not work for large drills.
Plugging - Vias are entirely filled with a non-conductive material. This ensures 100% of the via is filled so as no complications with tenting can happen, used for larger drills.
Now one thing I am not understanding is doesn't there need to be a wire that is fed through the via and soldered so as to create a conductive path between the bottom and top layers? If so wouldn't tenting/plugging ensure that no wire can be fed through the via as to create a conductive path. The way I see it, in this case, the via would be a useless hole.
Does the annular ring that feeds between the two layers give enough conductance between the two layers? How is the conductive path between the two layers established in these examples?
When would you use one versus the other? Does it have to do with the size of the drill or are there external factors that must also be considered?