I'm running into an issue with a specific RJ45 SMT connector where the I'm getting at least 1 pin lifting on >50% of the boards that run through our reflow oven. The rest of the components on the PCB do not have any issues with soldering, only this RJ45 connector.
The issue I'm having is with pins 9 or 12 in the image below.
The stencil that we are using has a thickness of 5 mils.
Most pins that are lifting are still partially soldered. The issue is that often with a slight amount of pressure on the pin the joint will crack and separate. It's like the paste has melted and then the pin lifts. With the pin lifted, the surface tension of the solder maintains the connection but it is very weak. If the pin lifts far enough the surface tension will break and the pin will no longer have a connection.
The things I have tried in order to resolve this problem:
- Double check hole drill sizes, I've also tried enlarging the holes with a drill.
- Adjusted height of connector for more or less pressure from the pick and place machine when placing the component.
- I've double checked the amount of pressure applied by the pick and place machine when picking the part. No pins appear to be lifted prior to entry to the oven.
- Reflow profile has been adjusted to bring in to line with the manufacturer specified profile while not deviating from the allowable/recommended paste settings. For reference, we are using Indium 8.9hf as our paste.
- I've tried cutting off the plastic posts so that nothing is protruding through the holes and all of the strain relief is happening on the tabs on the front of the connector. This issue does not appear to be tied to the posts.
- I've tried adjusting placement of the part on the pad forward/backward to see if relative placement on the footprint has any affect.
Any additional suggestions on things I can try to resolve this issue are appreciated. I think I've covered most of the basics, but maybe somebody has some additional experience with a similar issue and can lend me the benefit of their experience.