I am designing an RF amplifier (< 13 GHz) and want to use a board with two layers. However, the RFIC footprint (16-VFQFN Exposed Pad) has RFIN on the left, VDD on top, RFOUT on the right, and VGG on the bottom side, see the schematic symbol.
My feeding network will be above the VDD pin. All N/C pins are connected to the GND. The package has an exposed pad also connected to GND. Both layers will be filled with GND.
Considering the outlined case, can I route the VGG signal on the bottom layer under the RFIC?